Facilities & Equipment

Research 2

The NDSU Research and Technology Park broke ground on the Research 2 (R2) facility in September 2002 and was completed in March 2004. The Park consists of approximately 55 acres and is located on the north end of the campus.

Research 2, a 75,000 sf research facility consists of three main wings: West wing, south wing and cleanroom wing.

West Wing

This wing contains the administrative and technical staff offices and meeting rooms for CNSE personnel, as well as four laboratories for the Center's electronics design and testing.

South Wing

This wing consists of traditional wet chemistry laboratories and researcher offices. Eight labs ranging from 882 sf to 1,470 sf in size are in this wing. These labs enable research in nanoscale materials research, including preparation and characterization, and include extensive facilities for combinatorial materials research science.

Cleanroom Wing

The 14,500 sf cleanroom wing in R2 contains 8,000 sf of service chase, 4,100 sf of Class 10,000 and 2,300 sf of Class 100 cleanrooms for microsensors and nanotechnology research, plus traditional semiconductor processes. CNSE conducts electronic miniaturization research and fabrication in the Class 10,000 and 100 cleanrooms. The key technologies housed in these cleanrooms include photolithography, wet chemistry and thin film deposition. The Class 100 rooms include a Nanoblock™ fabrication line and Class 10,000 rooms include a Chip Scale Packaging fabrication line.

Cleanroom Capabilities

Thin Film (Sensors, RFID, Solar, Thin Film Devices)

  • Thin film deposition of metals (sputtering)
  • Thin film deposition of organics, dielectrics, ceramics (PECVD, spin-coat)
  • Patterning through photolithography
  • Plasma etching and cleaning (RIE)
  • Chemical etching, micromachining
  • UV laser machining
  • Fluidic self assembly and lamination
  • Silicon molds
  • Ellipsometry
  • Redistribution layer (RDL) formation
  • Wafer bumping

Thick Film (RFID, SMT)

  • Metals electroplating
  • Dielectrics electro-coating
  • Electroless plating (Ni)
  • Patterning conductive and non-conductive materials using screen and stencil printing (fluxes, adhesives, metal-filled epoxies)
  • Dispensing conductive and non-conductive materials (fluxes, adhesives, metal filled epoxies, under-fills)
  • Corrosion protection

Systems Assembly (Printed Circuit Board Assembly)

  • Analog, Radio Frequency (RF) and Digital PCBs
  • Assembly of:
    • Single-sided circuit boards
    • Two-sided circuit boards
    • Flexible and rigid circuit boards
  • No-lead or eutectic Pb/Sn
  • No-Clean and Water-Soluble Fluxes
  • Green processing
  • Manual assembly
  • Single-layer PCB rapid prototyping
  • Rework
  • Hand soldering
  • Pick and place 2.2 inches square components down to 01005 size including BGAs, Flat packs, QFNs, LGAs, Flip Chips
  • Laser marking, patterning
  • Laser cutting (substrates, diamond, metal sheets)
  • Singulation by punching
  • Singulation by saw
  • PCB Technologies
    • System-in-Package (SiP)
    • Chip-on-Board (COB)
    • Mixed Technology-(both Through-hole and/or SMT components to single or double sided circuit card assembly)
    • Pin-in-Paste (PIP)
  • Dry and wet cleaning (plasma, chemical, ultrasonic)

Advanced Chip Packaging (Processor, Memory, System in Package)

  • Substrate and package design and electrical, mechanical, and thermal simulation
  • Single-chip packaging
  • Multiple-chip packaging
  • Ceramic (hermetic) package processing/assembly
  • System miniaturization
  • Wafer bumping
  • Chip stacking
  • Wafer and substrate dicing
  • Direct die attach
  • Flip chip die attach
  • Gold and Aluminum wire bonding
  • Gold stud bumping
  • Glob-top
  • Through sapphire via
  • Dispensing conductive and non-conductive materials
  • Over-molding/Encapsulation
  • Elevated temperature processing
  • Autoclave processing
  • Lamination
  • Solder ball attach
  • Solder ball formation on wafers and substrates
  • Laser marking, patterning
  • Laser cutting (substrates, diamond, metal sheets)
  • Punching. Singulation.

MEMS

  • Si etching
  • Redistribution layer (RDL) formation
  • Laser ablation. Laser micromachining
  • Silicon molds

Test and Measurement

  • Optical inspection.
  • Stereo and confocal microscopy
  • Digital imaging.
  • Optical dimensional measurement
  • Film thickness measurement (transparent and translucent)
  • Live X-ray imaging
  • Surface profiling.
  • Thermal profiling (IR)
  • Acoustic microscopy (c-SAM).
  • SEM/EDX
  • Metallography (cross-sectioning)
  • Mechanical testing through shear, pull and indentation
  • Micro-hardness testing.
  • Drop testing
  • Thermocycling.
  • Thermal Shock.
  • HAST
  • Electrical testing.
  • Electrical probing

Curing, Aging and Storage

  • Aging: Profile or steady-state. Ambient or N2
  • Curing: Profile or steady-state. UV
  • Storage: Inert gas, dry, cold storage
  • Vacuum processing and aging