NDSU Center for Nanoscale Science & Engineering

North Dakota State University

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  • Facilities & Equipment
  • Bioactive Materials Characterization
  • Combinatorial Science
    • Design
    • Polymer Synthesis
    • Polymer Screening
    • Coating Preparation
    • Coating Deposition
    • Coating Screening
    • Analysis
  • Electronics Design
    • Design & Testing
  • Electronics Prototype Fabrication
    • Advanced Chip Packaging & Assembly
    • Process Support Equipment
    • Test & Inspection
    • Fluidic Self Assembly
    • Wafer Processing
  • Materials Characterization
  • RFID Lab - RWSL

Electronics Prototype Fabrication

Test, Inspection, and Imaging

  • Buehler Microhardness Tester
  • Cal-Tex VZM Digital Imaging (Inspection, Imaging, and Measurements)
  • Centipede/Checksum Circuit Tester
  • Dage Wire Pull/Ball Shear Tester
  • HiRox 5040RZ Digital Direct and Peripheral Image (inspection microscope)
  • Leica DM ILM Metallurgical Microscope (optical and digital image acquisition)
  • Leica S6D (inspection microscope)
  • National 407TBL (inspection microscope)
  • OGP Measuring System
  • Olympus BH2-MJL (Inspection and Imaging)
  • Sony TL-10M (inspection and imaging)

CSP: Chip Scale Package
ESD: Electrostatic Discharge
N2: Nitrogen gas
PCB: Printed Circuit Board
SMT: Surface Mount Technology

 

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