Electronics Prototype Fabrication
Advanced Chip Packaging & Assembly
- A Line Vacuum Sealer
- ADT Dicing Saw
- Ball Grid Array Solder Ball Placement System
- Camalot Dispenser
- DEK Stencil Printer
- UV Film Release / UV Curing System
- Electrovert Reflow Oven
- Hanmi Molding Compound Pellet Preheater
- Hanmi Molding Press
- Homemade Dispensing System
- K&S 1488 Tab Bonder
- K&S 8028 Wire Bonder
- MYDATA Pick & Place
- Milara Screen Printer
- OPTEK Laminator
- SEC Wafer Frame Mount/Film Frame Tape Applicator
- Shibaura High/Low Force Die Bonder
- Singulation Punch
- Tresky T-3200 Semi-Automated Die Bonder
- Trio Tech Autoclave
- Trumpf Laser Marker
- West Bond Manual Wire Bonder
BGA: Ball Grid Array
CSP: Chip Scale Package
ESD: Electrostatic Discharge
N2: Nitrogen gas
PCB: Printed Circuit Board
SMT: Surface Mount Technology